High-Yield Dicing of Anodically Bonded Silicon–Glass Wafers by Pressure-Induced Fracture

AuthID
 P-016-985
4
Author(s)
Robaina, RR
·
Perez-Castillejos, R
·
Plaza, JA
Tipo de Documento
Article
Year published
2012
Publicado
in Journal of Micromechanics and Microengineering, ISSN: 0960-1317
Volume: 22, Número: 2, Páginas: 025023
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ISSN: 0960-1317
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