On the Duality Gap for Thermal Unit Commitment Problems

AuthID
P-007-5XE
1
Author(s)
Tipo de Documento
Proceedings Paper
Year published
1993
Publicado
in Proceedings - IEEE International Symposium on Circuits and Systems, ISSN: 0271-4310
Volume: 4, Páginas: 2204-2207
Conference
Proceedings of the 1993 Ieee International Symposium on Circuits and Systems, Date: 3 May 1993 through 6 May 1993, Location: Chicago, IL, USA
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-0027308379
Source Identifiers
ISSN: 0271-4310
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