Processability and Electrical Characteristics of Glass Substrates for Rf Wafer-Level Chip-Scale Packages

AuthID
P-007-AVZ
7
Author(s)
Polyakov, A
·
Sinaga, SM
·
Tipo de Documento
Proceedings Paper
Year published
2003
Publicado
in 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS in ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ISSN: 0569-5503
Páginas: 875-880 (6)
Conference
53Rd Electronic Components and Technology Conference, Date: MAY 27-30, 2003, Location: NEW ORLEANS, LA, Patrocinadores: IEEE, CPMT, Electr Components, Assemblies & Mat Assoc, Electr Ind Alliance
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-0038688978
Wos: WOS:000183448100146
Source Identifiers
ISSN: 0569-5503
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