Wafer-Level Chip-Scale Packaging for Low-End Rf Products

AuthID
P-007-DDG
7
Author(s)
Bartek, M
·
Zilber, G
·
Polyakov, A
·
Sinaga, S
·
Burghartz, JN
1
Editor(es)
Cressler J.D.Papapolymerou J.
Tipo de Documento
Proceedings Paper
Year published
2004
Publicado
in 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
Páginas: 41-44
Conference
2004 Topical Meeting on Silicon Monolithic Integrated Circuits in Rf Systems: Digest of Papers, Date: 8 September 2004 through 10 September 2004, Location: Atlanta, GA, Patrocinadores: IEEE Microwave Theory and Techniques Society;Georgia Electronic Design Center at Georgia Tech
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-20344394890
Export Publication Metadata
Info
At this moment we don't have any links to full text documens.