Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films

AuthID
 P-000-QRM
4
Author(s)
1
Editor(es)
Vieira,T
Tipo de Documento
Article
Year published
2002
Publicado
in ADVANCED MATERIALS FORUM I in KEY ENGINEERING MATERIALS, ISSN: 1013-9826
Volume: 230-2, Páginas: 513-516 (4)
Conference
1St International Materials Symposium (Materials 2001), Date: APR 09-11, 2001, Location: COIMBRA, PORTUGAL, Patrocinadores: Portuguese Soc Mat, Host: UNIV COIMBRA
Indexing
Wos®
Scopus®
Crossref®6
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-0036436547
Wos: WOS:000179553200118
Source Identifiers
ISSN: 1013-9826
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