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Characterization of High-Resistivity Polycrystalline Silicon Substrates for Wafer-Level Packaging and Integration of Rf Passives

AuthID
P-007-EFT

Author(s)

Bartek, M

Polyakov, A

Sinaga, SM

Mendes, PM

Correia, JH

Burghartz, JN

Editor(es)

Osvald J.Hascik S.Osvald J.Hascik S.

Tipo de Documento

Proceedings Paper

Year published

2004

Publicado

in ASDAM 2004 - Conference Proceedings, 5th International Conference on Semiconductor Devices and Microsystmes

Páginas: 227-230

Conference

Asdam 2004 - 5Th International Conference on Semiconductor Devices and Microsystmes, Date: 17 October 2004 through 21 October 2004, Location: Smolenics Castle, Patrocinadores: Commission of the European Communities;IEEE Electron Devices Society

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Scopus^®

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SCOPUS: 2-s2.0-28844481087

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Characterization of High-Resistivity Polycrystalline Silicon Substrates for Wafer-Level Packaging and Integration of Rf Passives

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Characterization of High-Resistivity Polycrystalline Silicon Substrates for Wafer-Level Packaging and Integration of Rf Passives

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