Trends and Challenges in Lead Free Soldering

AuthID
P-008-3ZB
4
Author(s)
Dias Lopes, EM
·
Tipo de Documento
Proceedings Paper
Year published
2012
Publicado
in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
Conference
2012 13Th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Eurosime 2012, Date: 16 April 2012 through 18 April 2012, Location: Cascais
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-84861359997
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