in 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008
Páginas: 569-577
Conference
4Th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, Cicmt 2008, Date: 21 April 2008 through 24 April 2008, Location: Munich, Patrocinadores: International Microelectronics and Packaging Society (IMAPS);The American Ceramic Society (ACerS)
