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Algorithms For Coupled Transient Simulation Of Circuits And Complicated 3-D Packaging

AuthID
P-009-0J9

Author(s)

SILVEIRA, LM

KAMON, M

WHITE, J

Tipo de Documento

Article

Year published

1995

Publicado

in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, ISSN: 1070-9894

Volume: 18, Número: 1, Páginas: 92-98 (7)

Conference

44Th Electronic Components and Technology Conference, Date: MAY 01-04, 1994, Location: WASHINGTON, DC, Patrocinadores: IEEE, Components Hybrids & Mfg Technol Soc, Electr Ind Assoc

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Publication Identifiers

DOI: 10.1109/96.365494

SCOPUS: 2-s2.0-0029244870

Wos: WOS:A1995QH13100019

Source Identifiers

ISSN: 1070-9894

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Algorithms For Coupled Transient Simulation Of Circuits And Complicated 3-D Packaging

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