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Characterization of High-Resistivity Polycrystalline Silicon Substrates for Wafer-Level Packaging and Integration of Rf Passives

AuthID
P-00G-A76

Author(s)

Bartek, M

Polyakov, A

Sinaga, SM

Mendes, PM

Correia, JH

Burghartz, JN

Editor(es)

Osvald, J; Hascik, S

Tipo de Documento

Proceedings Paper

Year published

2004

Publicado

in ASDAM 2004: The Fifth International Conference on Advanced Semiconductor Devices and Microsystems

Páginas: 227-230 (4)

Conference

5Th International Conference on Advanced Semiconductor Devices and Microsystems, Date: OCT 17-21, 2004, Location: Smolenice, SLOVAKIA, Patrocinadores: Slovak Acad Sci, Inst Elect Engn, Slovak Univ Technol, Fac Elect Engn& Informat Technol, MIcroelectron Dept, European Comm Represented Commiss European Comm Res Directorate Gen, IEEE Elect Dev Soc

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Characterization of High-Resistivity Polycrystalline Silicon Substrates for Wafer-Level Packaging and Integration of Rf Passives

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Characterization of High-Resistivity Polycrystalline Silicon Substrates for Wafer-Level Packaging and Integration of Rf Passives

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