Microstructure Evolution with Direct Current Density on Electrodeposited Copper Films

AuthID
P-00G-QB7
3
Author(s)
Tipo de Documento
Editorial Material
Year published
2015
Publicado
in Microscopy and Microanalysis, ISSN: 1431-9276
Volume: 21, Número: S5, Páginas: 45-46
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Publication Identifiers
SCOPUS: 2-s2.0-84944036416
Source Identifiers
ISSN: 1431-9276
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