Publicações

Low-Temperature Thermal Conductivity of Highly Porous Copper

AuthID
P-00K-0T5

Author(s)

Martins, D

Cooper, A

Editor(es)

Weisend II,JG;Demko,J;DiPirro,M;Howell,M;DAntonio,A;Kittel,P;Klebaner,A;Marquardt,J;Nellis,G;Peterson,T;Pfotenhauer,J;Yuan,S;AlZeller

Tipo de Documento

Proceedings Paper

Year published

2015

Publicado

in ADVANCES IN CRYOGENIC ENGINEERING in IOP Conference Series-Materials Science and Engineering, ISSN: 1757-8981

Volume: 101, Número: 1

Conference

Cryogenic Engineering Conference (Cec) / International Cryogenic Materials Conference (Icmc), Date: JUN 28-JUL 02, 2015, Location: Tucson, AZ, Patrocinadores: Air Liquide, Cryomech Inc, Demaco, IEEE Council Superconductiv, Linde, TechSource, Visit Tucson

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