Modeling The Reflow Soldering Process In Pcb's

AuthID
 P-00K-2WJ
8
Author(s)
Costa, J
·
Soares, D
·
Ribas, L
·
Tipo de Documento
Proceedings Paper
Year published
2015
Publicado
in INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2
Volume: 2
Conference
Asme International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack), Date: JUL 06-09, 2015, Location: San Francisco, CA, Patrocinadores: ASME
Indexing
Wos®
Scopus®
Crossref®2
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-84953923613
Wos: WOS:000373517300032
Export Publication Metadata
Lista Marked
 Adicionar à lista Marked
Info
At this moment we don't have any links to full text documens.

Um espaço para investigadores e suas Instituições

Links Úteis

Ajuda

© 2024 CRACS & Inesc TEC - All Rights Reserved Política de Privacidade | Terms of Service