On the Kinetics of Copper Electroless Plating with Hypophosphite Reductant

AuthID
P-00K-EH6
2
Author(s)
Tipo de Documento
Article
Year published
2016
Publicado
in SURFACE ENGINEERING, ISSN: 0267-0844
Volume: 32, Número: 5, Páginas: 363-371 (9)
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-84964411270
Wos: WOS:000374571500006
Source Identifiers
ISSN: 0267-0844
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