A 45 Degrees Saw-Dicing Process Applied to a Glass Substrate for Wafer-Level Optical Splitter Fabrication for Optical Coherence Tomography

AuthID
 P-00K-P1Z
8
Author(s)
Peixoto, AC
·
Tipo de Documento
Article
Year published
2016
Publicado
in JOURNAL OF MICROMECHANICS AND MICROENGINEERING, ISSN: 0960-1317
Volume: 26, Número: 8, Páginas: 084001 (8)
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Publication Identifiers
SCOPUS: 2-s2.0-84979527235
Wos: WOS:000399879500001
Source Identifiers
ISSN: 0960-1317
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