Publicações

Implementation of Keep-Out-Zones to Protect Sensitive Sensor Areas During Backend Processing in Wafer Level Packaging Technology

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P-00K-WC2

Author(s)

Cardoso, A

Pires, M

Pinto, R

Fernades, E

Barros, I

Kuisma, H

Nurmi, S

Tipo de Documento

Proceedings Paper

Year published

2016

Publicado

in 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) in Electronic Components and Technology Conference, ISSN: 0569-5503

Volume: 2016-August, Páginas: 1160-1166 (7)

Conference

66Th Ieee Electronic Components and Technology Conference (Ectc), Date: MAY 31-JUN 03, 2016, Location: Las Vegas, NV, Patrocinadores: IEEE, IEEE Components Packaging & Mfg Technol Soc

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Publication Identifiers

DOI: 10.1109/ectc.2016.185

SCOPUS: 2-s2.0-84987816137

Wos: WOS:000386103500169

Source Identifiers

ISSN: 0569-5503

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Implementation of Keep-Out-Zones to Protect Sensitive Sensor Areas During Backend Processing in Wafer Level Packaging Technology

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Implementation of Keep-Out-Zones to Protect Sensitive Sensor Areas During Backend Processing in Wafer Level Packaging Technology

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