2 Phase Microprocessor Cooling System with Controlled Pool Boiling of Dielectrics over Micro-Andnano Structured Integrated Heat Spreaders

AuthID
P-00M-BZA
4
Author(s)
Tipo de Documento
Proceedings Paper
Year published
2016
Publicado
in 2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) in Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ISSN: 1087-9870
Páginas: 378-387 (10)
Conference
15Th Ieee Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm), Date: MAY 31-JUN 03, 2016, Location: Las Vegas, NV, Patrocinadores: IEEE, IEEE Components Packaging & Mfg Technol Soc
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Publication Identifiers
Wos: WOS:000390436000055
Source Identifiers
ISSN: 1087-9870
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