Publicações

Homogenization on Multi-Materials' Elements: Application to Printed Circuit Boards and Warpage Analysis

AuthID
P-00M-EQ0

Author(s)

Araujo, M

Alves, JL

Silva, P

Delgado, P

Editor(es)

Saanouni,K;Chenot,JL;Duval,JL

Tipo de Documento

Proceedings Paper

Year published

2016

Publicado

in NUMIFORM 2016: THE 12TH INTERNATIONAL CONFERENCE ON NUMERICAL METHODS IN INDUSTRIAL FORMING PROCESSES in MATEC Web of Conferences, ISSN: 2261-236X

Volume: 80

Conference

12Th International Conference on Numerical Methods in Industrial Forming Processes (Numiform), Date: JUL 04-07, 2016, Location: Univ Technol Troyes, Troyes, FRANCE, Patrocinadores: ESI Grp, Transvalor SA, Reg Champagne Ardenne, Conseil Gen lAube, QForm, Grand Troyes, lAssoc Francaise Mecanique, MECAMAT, Mk2i, Composite Integr, Host: Univ Technol Troyes

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