Effect of the Bismuth Content on the Interface Reactions Between Copper Substrate and Sn-Zn-Al-Bi Lead-Free Solder

AuthID
 P-000-6PZ
5
Author(s)
Tipo de Documento
Article
Year published
2005
Publicado
in REVISTA DE METALURGIA, ISSN: 0034-8570
Volume: SPEC. VOL., Número: Extra, Páginas: 208-212 (5)
Conference
9Th National Congress on Metallurgical Science and Technology, Date: NOV 05-07, 2003, Location: Madrid, SPAIN
Indexing
Wos®
Scopus®
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Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-33644640559
Wos: WOS:000237464800036
Source Identifiers
ISSN: 0034-8570
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