Creep Behavior of a Solder Paste with Bi Addition

AuthID
 P-00N-HZH
6
Author(s)
Ribeiro, PE
·
Barros, DA
·
Tipo de Documento
Proceedings Paper
Year published
2018
Publicado
in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2017 VOL 14
Volume: 14
Conference
Asme International Mechanical Engineering Congress and Exposition, Date: NOV 03-09, 2017, Location: Tampa, FL, Patrocinadores: ASME
Indexing
Wos®
Scopus®
Crossref®2
Handle®
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85040941584
Wos: WOS:000430517800044
Export Publication Metadata
Lista Marked
 Adicionar à lista Marked
Info
At this moment we don't have any links to full text documens.

Um espaço para investigadores e suas Instituições

Links Úteis

Ajuda

© 2024 CRACS & Inesc TEC - All Rights Reserved Política de Privacidade | Terms of Service