Creep Behavior of a Solder Paste with Bi Addition

AuthID
 P-00N-HZH
6
Author(s)
Barros, DA
·
Document Type
Proceedings Paper
Year published
2018
Published
in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2017 VOL 14
Volume: 14
Conference
Asme International Mechanical Engineering Congress and Exposition, Date: NOV 03-09, 2017, Location: Tampa, FL, Sponsors: ASME
Indexing
Wos®
Scopus®
Crossref®2
Google Scholar®
Publication Identifiers
Scopus: 2-s2.0-85040941584
Wos: WOS:000430517800044
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