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Heterogeneous Integration Challenges Within Wafer Level Fan-Out Sip for Wearables and Iot

AuthID
P-00P-GV9

Author(s)

Martins, A

Pinheiro, M

Ferreira, AF

Almeida, R

Matos, F

Oliveira, J

Silva, RP

Santos, H

Monteiro, M

Gamboa, H

Tipo de Documento

Proceedings Paper

Year published

2018

Publicado

in Proceedings - Electronic Components and Technology Conference, ISSN: 0569-5503

Volume: 2018-May, Páginas: 1485-1492

Conference

68Th Ieee Electronic Components and Technology Conference, Ectc 2018, Date: 29 May 2018 through 1 June 2018, Patrocinadores: IEEE Electronics Packaging Society (EPS)

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Publication Identifiers

DOI: 10.1109/ectc.2018.00226

SCOPUS: 2-s2.0-85051997860

Source Identifiers

ISSN: 0569-5503

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Heterogeneous Integration Challenges Within Wafer Level Fan-Out Sip for Wearables and Iot

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