Publicações

Mutual Coupling Reduction Using Grounded Copper Vertical Plane Structure

AuthID
P-00P-WA1

Author(s)

Bouça, P

De Carvalho, NB

Pinho, P

Tipo de Documento

Proceedings Paper

Year published

2018

Publicado

in 2018 IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies, IMWS-5G 2018

Conference

2018 Ieee Mtt-S International Microwave Workshop Series on 5G Hardware and System Technologies, Imws-5G 2018, Date: 30 August 2018 through 31 August 2018

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Metadata
Fontes

Publication Identifiers

DOI: 10.1109/imws-5g.2018.8484705

Handle: https://hdl.handle.net/10400.21/8923

SCOPUS: 2-s2.0-85056417183

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Mutual Coupling Reduction Using Grounded Copper Vertical Plane Structure

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