Publicações

AuthID
P-00Q-4YE

Author(s)

Martins, A

Ferreira, AF

Almeida, R

Matos, F

Oliveira, J

O'Toole, E

Monteiro, MC

Silva, RP

Tipo de Documento

Proceedings Paper

Year published

2018

Publicado

in 2018 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC)

Conference

International Wafer Level Packaging Conference (Iwlpc), Date: OCT 23-25, 2018, Location: San Jose, CA

Indexing

Wos^®

Scopus^®

Crossref^®

Google Scholar^®

Publication Identifiers

DOI: 10.23919/iwlpc.2018.8573275

SCOPUS: 2-s2.0-85060450899

Wos: WOS:000462176800015

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