Numerical Simulations of Adhesive Spreading During Bonding-Induced Squeeze

AuthID
 P-00V-GD9
5
Author(s)
Silva, LA
·
Espinosa, C
·
Paroissien, E
·
Lachaud, F
·
Tipo de Documento
Article in Press
Year published
2021
Publicado
in JOURNAL OF ADHESION, ISSN: 0021-8464
Páginas: 1-33 (33)
Indexing
Wos®
Scopus®
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Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85115614008
Wos: WOS:000698912100001
Source Identifiers
ISSN: 0021-8464
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