Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis

AuthID
 P-00W-JTG
5
Author(s)
Oliveira, BMC
·
Ferreira, PJ
·
Tipo de Documento
Article
Year published
2022
Publicado
in NANOMATERIALS
Volume: 12, Número: 10, Páginas: 1752 (15)
Indexing
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Scopus®
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Pubmed®
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Publication Identifiers
Pubmed: 35630972
SCOPUS: 2-s2.0-85130361688
Wos: WOS:000803205000001
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