A Hybrid Panel Level Package (Hybrid Plp) Technology Based on a 650-Mm X 650-Mm Platform

AuthID
 P-00W-YSC
11
Author(s)
O'Toole, E
·
Silva, JL
·
Cardoso, F
·
Silva, J
·
Souto, M
·
Delduque, N
·
Coelho, A
·
Silva, JM
·
Do, W
·
Khim, J
Tipo de Documento
Proceedings Paper
Year published
2022
Publicado
in IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022) in Electronic Components and Technology Conference, ISSN: 0569-5503
Volume: 2022-May, Páginas: 824-827 (4)
Conference
72Nd Ieee Electronic Components and Technology Conference (Ectc), Date: MAY 31-JUN 01, 2022, Location: San Diego, CA, Patrocinadores: IEEE
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Publication Identifiers
SCOPUS: 2-s2.0-85134641377
Wos: WOS:000848765300129
Source Identifiers
ISSN: 0569-5503
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