Mushroom-Type High-Impedance Surface With Loaded Vias: Homogenization Model and Ultra-Thin Design

AuthID
 P-002-YPZ
4
Author(s)
Yakovlev, AB
·
Tipo de Documento
Article
Year published
2011
Publicado
in IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, ISSN: 1536-1225
Volume: 10, Páginas: 1503-1506 (4)
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Publication Identifiers
SCOPUS: 2-s2.0-84856961926
Wos: WOS:000299940400008
Source Identifiers
ISSN: 1536-1225
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