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Paulo Mateus Mendes
AuthID:
R-000-EJC
Publications
Confirmed
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Document Source:
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Document Type:
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Proceedings Paper (73)
Article (16)
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Confirmed Publications: 89
81
TITLE:
An integrated folded-patch antenna for wireless microsystems
AUTHORS:
Mendes, PM
; Polyakov, A;
Bartek, M
;
Burghartz, JN
;
Correia, JH
;
PUBLISHED:
2004
,
SOURCE:
IEEE Sensors 2004 Conference
in
PROCEEDINGS OF THE IEEE SENSORS 2004, VOLS 1-3,
VOLUME:
1
INDEXED IN:
Scopus
WOS
CrossRef
IN MY:
ORCID
|
ResearcherID
82
TITLE:
An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
AUTHORS:
Mendes, PM
; Polyakov, A; Bartek, M;
Burghartz, JN
;
Correia, JH
;
PUBLISHED:
2004
,
SOURCE:
5th International Conference on Advanced Semiconductor Devices and Microsystems
in
ASDAM 2004: The Fifth International Conference on Advanced Semiconductor Devices and Microsystems
INDEXED IN:
Scopus
WOS
IN MY:
ORCID
|
ResearcherID
83
TITLE:
Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives
AUTHORS:
Bartek, M; Polyakov, A; Sinaga, SM;
Mendes, PM
;
Correia, JH
; Burghartz, JN;
PUBLISHED:
2004
,
SOURCE:
ASDAM 2004 - 5th International Conference on Semiconductor Devices and Microsystmes
in
ASDAM 2004 - Conference Proceedings, 5th International Conference on Semiconductor Devices and Microsystmes
INDEXED IN:
Scopus
IN MY:
ORCID
84
TITLE:
Novel very small dual-band chip-size antenna for wireless sensor networks
AUTHORS:
Mendes, PM
; Bartek, M;
Burghartz, JN
;
Correia, JH
;
PUBLISHED:
2004
,
SOURCE:
IEEE Radio and Wireless Conference (RAWCON 2004)
in
RAWCON: 2004 IEEE RADIO AND WIRELESS CONFERENCE, PROCEEDINGS
INDEXED IN:
Scopus
WOS
IN MY:
ORCID
|
ResearcherID
85
TITLE:
Size reduction and tuning of integrated folded patch antennas using slots
AUTHORS:
Mendes, PM
; Bartek, M;
Burghartz, JN
;
Correia, JH
;
PUBLISHED:
2004
,
SOURCE:
34th European Microwave Conference (EuMC)
in
34TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS,
VOLUME:
3
INDEXED IN:
Scopus
WOS
IN MY:
ORCID
86
TITLE:
Wafer-level chip-scale packaging for low-end RF products
AUTHORS:
Bartek, M; Zilber, G;
Teomin, D
; Polyakov, A; Sinaga, S;
Mendes, PM
; Burghartz, JN;
PUBLISHED:
2004
,
SOURCE:
2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
in
2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
INDEXED IN:
Scopus
IN MY:
ORCID
87
TITLE:
Wafer-level integration of on-chip antennas and RE passives using high-resistivity polysilicon substrate technology
AUTHORS:
Mendes, PM
; Sinaga, S; Polyakov, A; Bartek, M; Burghartz, JN;
Correia, JH
;
PUBLISHED:
2004
,
SOURCE:
54th Electronic Components and Technology Conference
in
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS,
VOLUME:
2
INDEXED IN:
Scopus
WOS
IN MY:
ORCID
88
TITLE:
Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems
AUTHORS:
Mendes, PM
; Bartek, M;
Burghartz, JN
;
Correia, JH
;
PUBLISHED:
2003
,
SOURCE:
2003 IEEE International Antennas and Propagation Symposium and USNC/CNC/URSI North American Radio Science Meeting
in
IEEE Antennas and Propagation Society, AP-S International Symposium (Digest),
VOLUME:
2
INDEXED IN:
Scopus
IN MY:
ORCID
89
TITLE:
Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages
AUTHORS:
Polyakov, A;
Mendes, PM
; Sinaga, SM;
Bartek, M
;
Rejaei, B
;
Correia, JH
;
Burghartz, JN
;
PUBLISHED:
2003
,
SOURCE:
53rd Electronic Components and Technology Conference
in
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS
INDEXED IN:
Scopus
WOS
CrossRef
IN MY:
ORCID
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