Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder

AuthID
P-00Y-YD7
8
Author(s)
Ribeiro P.E.
·
Barros D.A.
·
Soares D.F.
·
Capela P.
·
Tipo de Documento
Proceedings Paper
Year published
2018
Publicado
in ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume: 12
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-85060372892
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