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Wafer-Level Integration of On-Chip Antennas and Re Passives Using High-Resistivity Polysilicon Substrate Technology

AuthID
P-007-C2X

Author(s)

Mendes, PM

Sinaga, S

Polyakov, A

Bartek, M

Burghartz, JN

Correia, JH

Tipo de Documento

Proceedings Paper

Year published

2004

Publicado

in 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS in Electronic Components and Technology Conference, ISSN: 0569-5503

Volume: 2, Páginas: 1879-1884 (6)

Conference

54Th Electronic Components and Technology Conference, Date: FEB 03, 2004, Location: Las Vegas, NV, Patrocinadores: Elect Components Assembilies & Mat Assoc, Elect Ind Alliance, IEEE Comp Packaging & Mfg Technol Soc

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Publication Identifiers

SCOPUS: 2-s2.0-10444283439

Wos: WOS:000224340900298

Source Identifiers

ISSN: 0569-5503

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Wafer-Level Integration of On-Chip Antennas and Re Passives Using High-Resistivity Polysilicon Substrate Technology

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Wafer-Level Integration of On-Chip Antennas and Re Passives Using High-Resistivity Polysilicon Substrate Technology

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