Cu3Teo6Dielectric Thick Films: Processing by Electrophoretic Deposition and Electrical Characterization

AuthID
P-00G-QW3
3
Author(s)
1
Editor(es)
Boccaccini A.R.Van der Biest O.Uchikoshi T.Dickerson J.H.Ferrari B.
Tipo de Documento
Proceedings Paper
Year published
2015
Publicado
in Key Engineering Materials, ISSN: 1013-9826
Volume: 654, Páginas: 114-121
Conference
5Th International Conference on Electrophoretic Deposition: Fundamentals and Applications, Epd 2014, Date: 5 October 2014 through 10 October 2014, Patrocinadores: Engineering Conferences International (ECI)
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-84944322619
Source Identifiers
ISSN: 1013-9826
Export Publication Metadata
Info
At this moment we don't have any links to full text documens.