Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects

AuthID
 P-00W-31M
5
Author(s)
Oliveira, BMC
·
Savaris, LCG
·
Ferreira, PJ
·
Tipo de Documento
Article
Year published
2022
Publicado
in INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES, ISSN: 1661-6596
Volume: 23, Número: 3, Páginas: 1891 (15)
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Wos®
Scopus®
Crossref®2
Pubmed®
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Publication Identifiers
Pubmed: 35163817
SCOPUS: 2-s2.0-85124127688
Wos: WOS:000760090800001
Source Identifiers
ISSN: 1661-6596
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