D. Teomin
AuthID: R-007-44M
1
TÃTULO: Wafer-level chip-scale packaging for low-end RF products
AUTORES: Bartek, M; Zilber, G; Teomin, D; Polyakov, A; Sinaga, S; Mendes, PM ; Burghartz, JN;
PUBLICAÇÃO: 2004, FONTE: 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers in 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
AUTORES: Bartek, M; Zilber, G; Teomin, D; Polyakov, A; Sinaga, S; Mendes, PM ; Burghartz, JN;
PUBLICAÇÃO: 2004, FONTE: 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers in 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
INDEXADO EM: 
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