B. Rejaei
AuthID: R-00G-NDY
1
TÃTULO: Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages
AUTORES: Polyakov, A; Mendes, PM ; Sinaga, SM; Bartek, M; Rejaei, B; Correia, JH ; Burghartz, JN;
PUBLICAÇÃO: 2003, FONTE: 53rd Electronic Components and Technology Conference in 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS
AUTORES: Polyakov, A; Mendes, PM ; Sinaga, SM; Bartek, M; Rejaei, B; Correia, JH ; Burghartz, JN;
PUBLICAÇÃO: 2003, FONTE: 53rd Electronic Components and Technology Conference in 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS
