R. Quon
AuthID: R-00J-D46
1
TÃTULO: Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies Full Text
AUTORES: Augur, R; Child, C; Ahn, JH; Tang, TJ; Clevenger, L; Kioussis, D; Masuda, H; Srivastava, R; Oda, Y; Oguma, H; Quon, R; Kim, B; Sheng, H; Hirooka, S; Gupta, R; Thomas, A; Singh, SM; Fang, Q; Schiwon, R; Hamieh, B; ...Mais
PUBLICAÇÃO: 2012, FONTE: Microelectronic Engineering, VOLUME: 92
AUTORES: Augur, R; Child, C; Ahn, JH; Tang, TJ; Clevenger, L; Kioussis, D; Masuda, H; Srivastava, R; Oda, Y; Oguma, H; Quon, R; Kim, B; Sheng, H; Hirooka, S; Gupta, R; Thomas, A; Singh, SM; Fang, Q; Schiwon, R; Hamieh, B; ...Mais
PUBLICAÇÃO: 2012, FONTE: Microelectronic Engineering, VOLUME: 92