81
TÍTULO: An integrated folded-patch antenna for wireless microsystems
AUTORES: Mendes, PM ; Polyakov, A; Bartek, M; Burghartz, JN; Correia, JH ;
PUBLICAÇÃO: 2004, FONTE: IEEE Sensors 2004 Conference in PROCEEDINGS OF THE IEEE SENSORS 2004, VOLS 1-3, VOLUME: 1
INDEXADO EM: Scopus WOS CrossRef
82
TÍTULO: An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
AUTORES: Mendes, PM ; Polyakov, A; Bartek, M; Burghartz, JN; Correia, JH ;
PUBLICAÇÃO: 2004, FONTE: 5th International Conference on Advanced Semiconductor Devices and Microsystems in ASDAM 2004: The Fifth International Conference on Advanced Semiconductor Devices and Microsystems
INDEXADO EM: Scopus WOS
83
TÍTULO: Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives
AUTORES: Bartek, M; Polyakov, A; Sinaga, SM; Mendes, PM ; Correia, JH ; Burghartz, JN;
PUBLICAÇÃO: 2004, FONTE: ASDAM 2004 - 5th International Conference on Semiconductor Devices and Microsystmes in ASDAM 2004 - Conference Proceedings, 5th International Conference on Semiconductor Devices and Microsystmes
INDEXADO EM: Scopus
NO MEU: ORCID
84
TÍTULO: Novel very small dual-band chip-size antenna for wireless sensor networks
AUTORES: Mendes, PM ; Bartek, M; Burghartz, JN; Correia, JH ;
PUBLICAÇÃO: 2004, FONTE: IEEE Radio and Wireless Conference (RAWCON 2004) in RAWCON: 2004 IEEE RADIO AND WIRELESS CONFERENCE, PROCEEDINGS
INDEXADO EM: Scopus WOS
85
TÍTULO: Size reduction and tuning of integrated folded patch antennas using slots
AUTORES: Mendes, PM ; Bartek, M; Burghartz, JN; Correia, JH ;
PUBLICAÇÃO: 2004, FONTE: 34th European Microwave Conference (EuMC) in 34TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, VOLUME: 3
INDEXADO EM: Scopus WOS
NO MEU: ORCID
86
TÍTULO: Wafer-level chip-scale packaging for low-end RF products
AUTORES: Bartek, M; Zilber, G; Teomin, D; Polyakov, A; Sinaga, S; Mendes, PM ; Burghartz, JN;
PUBLICAÇÃO: 2004, FONTE: 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers in 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
INDEXADO EM: Scopus
NO MEU: ORCID
87
TÍTULO: Wafer-level integration of on-chip antennas and RE passives using high-resistivity polysilicon substrate technology
AUTORES: Mendes, PM ; Sinaga, S; Polyakov, A; Bartek, M; Burghartz, JN; Correia, JH ;
PUBLICAÇÃO: 2004, FONTE: 54th Electronic Components and Technology Conference in 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, VOLUME: 2
INDEXADO EM: Scopus WOS
NO MEU: ORCID
88
TÍTULO: Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems
AUTORES: Mendes, PM ; Bartek, M; Burghartz, JN; Correia, JH ;
PUBLICAÇÃO: 2003, FONTE: 2003 IEEE International Antennas and Propagation Symposium and USNC/CNC/URSI North American Radio Science Meeting in IEEE Antennas and Propagation Society, AP-S International Symposium (Digest), VOLUME: 2
INDEXADO EM: Scopus
NO MEU: ORCID
89
TÍTULO: Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages
AUTORES: Polyakov, A; Mendes, PM ; Sinaga, SM; Bartek, M; Rejaei, B; Correia, JH ; Burghartz, JN;
PUBLICAÇÃO: 2003, FONTE: 53rd Electronic Components and Technology Conference in 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS
INDEXADO EM: Scopus WOS CrossRef
NO MEU: ORCID
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